摘要
研究了均匀化热处理对高强高导Cu-Fe-Ag原位复合材料显微组织和性能的影响。结果表明,均匀化热处理细化了初生Fe枝晶及后续形变组织,促进Fe原子从Cu基体的析出,形成二次Fe颗粒和纳米尺度α-Fe粒子。同时均匀化热处理提高了Cu-Fe-Ag原位复合材料的强度和电导率。强化机制为位错强化和界面强化,电导率的增加是由于均匀化热处理过程中大量Fe原子从Cu基体中析出,导致杂质散射影响减小所致。
Effects of homogenization treatment on microstructure and properties of Cu-Fe-Ag in-situ copper based composites were investigated.The results show that the homogenization treatment can refine the primary Fe dendrites and deformed microstructure,resulting in promoting the precipitation of Fe from Cu matrix to form secondary Fe particles and nano-α-Fe particle.Furthermore,the homogenization treatment can enhance the strength and electrical conductivity of Cu-Fe-Ag in-situ copper based composites.Dislocation multiplication and interface obstacle are responsible for the strengthening mechanism.The decrease of Fe in Cu matrix is responsible for the increase of electrical conductivity due to the prior homogenization treatment before cold deformation.
作者
谢志雄
董仕节
罗平
Xie Zhixiong Dong Shijie Luo Ping
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2017年第3期316-319,共4页
Special Casting & Nonferrous Alloys
基金
国家自然科学基金资助项目(51375150)
湖北省重点实验室资助项目(省重点实验室科[2013]2-16)
关键词
高强高导
CU合金
均匀化热处理
High Strength and High Conductivity
Copper Alloy
Homogenization Treatment
