电子元器件镍金复合镀层厚度测试方法研究

Research on test method of nickel gold composite coating thickness of electronic component

目前,电子元器件复合金属镀层厚度的测量主要采用具有破坏性的金相切片法,该方法会对样品造成不可逆损伤。鉴于此,该文提出先培养基片,再通过X射线荧光测厚仪测量复合镀层厚度的基于过程工艺控制的无损检测法,并探究双层和三层镍金复合镀层结构,得到内层镀层对外层镀层测量的影响因子,并研究其测量误差。实验结果表明:该培养基片法在不破坏样品的情况下实现电子元器件复合金属镀层厚度的精确测量,为电子元器件生产过程中复合镀层厚度的控制提供技术支持,进一步完善电子元器件镀涂工艺。

measuredsamples. Presently, the thickness of composite metal coating on electronic component was mainly by the metallographic method, which was destructive, leading irreversible damage to theTo solve this problem, a non-destructive measurement based on the process control wasproposed, i.e., substrate-culturing method. This strategy involved two steps, cultivating thesubstrate and then measuring the thickness of the metal coating by X-ray fluorescence gauge. Thestructure of double-deck and triple-deck nickelgold composites coatings were also investigated,revealing the irdluence of the inner coating on the thickness measurement of the outer coating andits related measuring error. All these observations indicate that the proposed substrate-culturingmethod can accurately measure thickness without any sample destruction. This offers technologicalsupport for the coating thickness control during the electronic components production and furtherimproves the electronic plating coating technology.