高性能有机硅导热材料的制备与研究

Research on Preparation of High-Performance Thermal Conductive Silicone Materials

以反应性硅油为基料,氧化铝和氮化铝等为导热填料制得高性能有机硅导热垫片。较佳配方为:低黏度乙烯基硅油80 g、高黏度乙烯基硅油8 g、含氢硅油6 g、改性硅树脂5 g、催化剂1.0 g、抑制剂0.2 g、氮化铝55 g、氧化铝445 g、球形氧化铝402 g。以此配方制得的导热垫片的热导率达4.0 W/(m·K),操作使用方便,可靠性好,能满足客户高性能导热垫片的使用要求。

A high performance thermal conductive silicone gasket was prepared with the reactive silicone oil as the base materials, alumina and aluminum nitride as the thermal conductive fillers. A better formula is as following ： the low viscosity of vinyl silicone oil 80 g, high viscosity of vinyl silicone oil 8 g, hydrogen silicone oil 6 g, modified silicone resin 5 g, catalyst 1.0 g, inhibitors 0.2 g, alumina 55 g,aluminum nitride 445g, and spherical alumina 402 g. In the formula of thermal conductivity of thermal conductivity is 4.0W/（ m·K）, easy to operate, good reliability, meets the demands of the customers.