缩合型双组分室温硫化高强度低介电常数有机硅胶黏剂的研制

Preparation of a Condensation Two-component Room Temperature Curing Silicone Adhesive with High Strength and Low Dielectric Constant

介绍了一种双组分室温固化低介电常数有机硅胶黏剂的研制。探讨了含羟基硅橡胶相对分子质量以及交联剂的选择与用量、甲基MQ树脂的用量、填料的选择与处理对胶黏剂各性能的影响。并通过IR分析胶黏剂结构,TGA考察其耐热性,确定了最大强度与最佳介电性能的胶黏剂配方。制备的胶黏剂可室温固化,其拉伸强度≥5.2MPa,介电常数≤3(10GHz),介电损耗角正切tgδ≤0.004(10GHz)。

A two-component room temperature curing silicone adhesive with low dielectric constant has been developed. The adhesive formula with a maximum strength and optimal dielectric property is determined through the discussion of effects of the molecular weight of 107 silicone rub- ber, the selection and dosage of cross linking agent, methyl MQ resin dosage and the choice and processing of filler on the properties of adhesive, and through the IR analysis of the structure of adhesive and TGA study on the heat resistance. The prepared adhesive can be cured at room temperature, its tensile strength is more than or equal to 5.2Mpa, dielectric constant less than or equal to 3 （10Hz） and dielectric loss angle tangent is less than or equal to 0.004（10Hz）.