GaAs叠层电池芯片接收器的表面贴装工艺研究

Surface Mount Technology Study on GaAs Tandem Cell Chip-receiver

对GaAs叠层电池芯片接收器的表面贴装制备工艺进行了研究,针对包括丝网印刷、DCB贴片、回流焊在内的工艺进行了优化。采用优化后的工艺进行了GaAs叠层电池芯片接收器实际制备,然后开展了3D-X-ray测试和空洞率计算。研究证明,通过对表面贴装工艺各步骤的优化,95%的GaAs叠层电池芯片接收器空洞率小于5%,为提高实际生产中的芯片接收器质量和最终的聚光光伏系统效率提供了表面贴装工艺方面的优化改进参考。

This paper provides results of study on surface mount preparation technology of GaAs tandem cell chip-receiver,with optimization of process of screen printing,DCB SMT,reflow soldering,and electrode pad.The optimized process is applied to preparation and the 3D-X-ray test,and empty rate calculation is carried out.Results of the study show that after optimizing each of the steps,95% of the chip receiver void ratio become less than 5%.The paper also provides a surface mount technology improvements program for improving quality of the receiver chip and efficiency of concentrating photovoltaic.