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不同材质磨盘对蓝宝石晶片研磨性能的影响 被引量:3

Effect of different disc materials on sapphire wafer lapping process
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摘要 从实际生产加工的角度,研究磨盘材质和研磨磨料对蓝宝石晶片加工效果的影响。以实际生产工艺进行实验,比较铸铁磨盘、陶瓷复合盘、树脂铜盘和聚氨酯研磨布在使用B4C或金刚石研磨液时的加工效果、成品率和研磨效率。结果显示:经聚氨酯研磨布研磨的蓝宝石晶片,其表面质量最好,为Ra0.058μm;陶瓷复合盘的研磨效率最高,达到0.305μm/min,且成品率可保持在96.08%。如粗糙度要求较高(Ra≤0.06μm),则建议使用聚氨酯研磨布搭配金刚石研磨液;如果更强调成本和效率(粗糙度要求Ra≤0.08μm),建议使用陶瓷复合盘搭配B_4C研磨液。 Influence of disc material and abrasive on lapping effect of sapphire wafer is analyzed based on actual machining.Lapping effect,product yield and lapping efficiency are compared when using cast iron disc(CID),ceramic compound disc(CCD),resin-copper disc(RCD)and polyurethane cloth(PUC)with B4C or diamond slurry.The results show that surface quality of sapphire wafer lapped by PUC is best,Ra0.058μm,and that the lapping efficiency of CCD is highest,0.305μm/min with product yield at 96.08%.In conclusion,PUC and diamond slurry are recommended when requiring higher surface quality,such as Ra≤ 0.06μm,while CCD with B4C slurry is better if more emphasis is put on cost and efficiency(Ra≤ 0.08μm).
出处 《金刚石与磨料磨具工程》 CAS 2017年第1期78-80,共3页 Diamond & Abrasives Engineering
关键词 表面粗糙度 成品率 研磨效率 铸铁磨盘 陶瓷复合盘 树脂铜盘 聚氨酯研磨布 surface roughness product yield lapping efficiency cast iron disc ceramic compound disc resin-copper disc polyurethane cloth
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