盘中孔渗油力学模型分析与探究

Analysis and study on mechanical model of oil leakage

从业界发展状况来看，盘中孔塞孔技术存在一个普遍难题：盘中孔渗油，但是行业内对此问题的研究极少，因此本文从理论入手，通过分析盘中孔渗油力学失效模型可知，要改善渗油问题需同时提升孔口表面的油墨结合力并降低孔内气体产生的冲击力。油墨结合力与光固化和热固化双重因素相关，因此本文提出二次曝光流程实现表层油墨固化度提升，并通过优化终固化参数中的低、中温段，一方面增加表层油墨结合力，另一方面减少进入高温段后产生的挥发性气体，降低将油墨带出的冲击力，最终解决盘中孔渗油问题。

By a view of the current situation of PCB industry, we could know that the solder mask bubble out from via had seriously restricted the development of pad plug hole technology. But there are only a few researchers had investigated the defect, and the corresponding solutions were still rare until now. This article created the oil leakage mechanical model on the theory of the Ideal Gas Equation and deduced that the binding force of surface oil and the impact force in the hole must be changed in order to solve oil leakage. As we all know, the ink adhesion is associated with light curing and heat curing, so this experiment put forward the double exposure process to improve the curing degree of oil around the hole, and optimized the low and medium temperature section of final solidification temperature to increase the ink binding force and reduce the volatile gas which produced in high temperature. These measures could improve the resistance on the surface oil and decrease the impact force produced by the gas in the hole, and finally solved the oil leakage in the pad.