CO2激光生产氮化铝陶瓷板通孔工艺探讨

Discussion on though hole process of CO2 laser produced AIN ceramic plate board

随着LED光源向高功率、集成化方向发展，小尺寸LED电子产品的散热要求越来越高。由于陶瓷材料具有高机械强度、高热导率、优异的绝缘性和合适的热膨胀系数等特性，正好迎合LED电子产品的发展趋势，可满足高频、高散热等有特殊要求电路板相关要求。文章将就C02激光制作氮化铝陶瓷基扳通孔展开分析与探讨，主要包括激光参数、激光生产方式和采用不同垫板对陶瓷基板成孔孔型的影响，通过对以上参数或方式的有效控制而获得理想的通孔，为实现批量CO2激光生产氮化铝陶瓷板通孔做好基础工艺研究。

With the development of high power and integrated direction of LED light source, the heat dissipation requirements of small size LED electronic products become higher and higher. The ceramic material has high mechanical strength, high thermal conductivity, excellent insulation and suitable thermal expansion coefficient characteristics, which can meet the development trend of electronic products of LED, and can meet the high frequency, high heat and other special requirements of circuit board requirements. In this paper, CO2 laser fabrication of AIN ceramic substrates was introduced through hole expansion analysis and discussion mainly including laser parameters, laser mode of production and using of different plate effect of pore forming pass through holes on the ceramic substrate. Through effective control of tile above parameters or methods we can obtain ideal result, to achieve mass production of CO2 laser ceramic plate of AIN by the basic process.