层压空洞品质改善

Improve the quality of laminate void

层压空洞是PCB（线路板）加工过程中的一种常见的缺陷；此缺陷是PCB在压合过程中，因树脂填胶不充分而产生。这种树脂的空洞会大幅度降低PcB产品的耐电压性能，甚至会导致短路发生，严重影响产品的可靠性。文章通过填胶计算、压合参数优化、板件设计、叠板规范、设备改善、操作规范、物料管控等方面入手，改善填胶不足的问题。

Laminate void is a common drawback in the fabrication of PCB. This defect is caused by insufficient resin filling in the process of PCB lamination. Laminate void will significantly reduce the PCB＇s voltage resistance performance, and even lead to short-circuit occurs, and seriously affect the reliability of the product. In this paper, the problem of insufficient filling is improved by calculating the filling volume, optimizing the pressing parameters, perfecting the PCB design, standardizing the operation, improving the equipment and controlling the materials.