SOC制程在微盲孔填镀中的缺陷及改善

The improvement of SOC process in vis-fill plating process

选择性有机导电聚合工艺（SOC，Selectire Organic Conductire Polymerization）是一种绿色环保的工艺，代替传统PTH进行孔导通化，具有制程简单，环保节能的特点，但因其导电性不如PTH沉铜层好，且没有金属做铜生长的晶核，在电镀时往往存在镀层不连续或深镀能力差的现象，特别是盲孔玻纤处容易出现孔破的问题，需要通过改善SOC制程和预镀的工艺参数，加强生产过程中的品质控制，达到理想的电镀微盲孔品质，来满足生产的要求。

Selective organic conductive polymerization （SOC） is a kind of green technology, instead of the traditional PTH to make hole conductive（MHC）, has the characteristics of simple fabrication, energy saving and environmental protection. But because of the conductivity of PTH copper layer as well, and there is no metal copper crystal growth, discontinuous coating or deep plating ability poor phenomenon often exists in electroplating, especially easy to appear at the broken hole on blind via glass, which needs to improve the process parameters of SOC process and pre plating, to strengthen the quality control of the production process, to achieve the ideal of electroplating micro-via quality, to meet the requirements of production.