背面银浆中玻璃粉对太阳能电池背电极焊点的影响研究

Effects of Glass Frit in Back Silver Paste on Rear Busbar Solder Joints of Silicon Solar Cell

文章制备了3款玻璃化转变温度(T_g)不同的无铅玻璃粉,将其与银粉和有机载体混合配制成太阳能电池背面银浆,并通过印刷、烘干、烧结和焊接等工艺制备了晶硅太阳能电池的背电极焊点。文章提出了背电极焊点剥离的3种模式,研究了玻璃粉T_g对背电极焊点常规剥离附着力及剥离模式的影响,并选取了T_g适中的玻璃粉制备背面银浆,进一步研究了玻璃粉含量对背电极焊点高温老化后的剥离附着力及剥离模式的影响。

In this paper, three kinds of glass frit with different Tg have been prepared and used to produce back silver pastes with silver powder and organic vehicle. Then, rear busbar solder joints of silicon solar cell have been prepared through printing, drying, sintering and soldering processes, three kinds of peeling mode have been suggested and the effects of glass frit Ts on the adhesion and the peeling mode of rear busbar solder joints have been discussed. Furthermore, glass frit with proper Ts has been used to pre- pare back silver pastes and the effects of glass frit content on the peeling mode and adhesion of rear busbar solder joints after aging process have also been studied.