测试假点的制程管控重点

The key points of process control and tool making for testing false points

电路板布线高密度化,目前已有许多的PCB产品已经达到BGA焊盘点大小在0.20 mm(8 mil)内,使得电测治具的对准度及机台的水平度有更高的要求。为了达到有效测试,需对设备、治具、现场环境做好管控要求。文章主要对测试流程的控制及测试治具的制作进行讨论。

With the density of circuit board wiring increasing requirements, many PCB products have reached BGA welding inventory size in 8mil, making the fixture alignment and machine level with higher requirements. In order to achieve effective testing of equipment, the fixture, site environment, and control required improvement. In this paper, the main production sharing, control and test fixture in the testing process are discussed.