摘要
HDI板中同时存在激光孔及机械通孔,且两种孔的对位基准点与设备精度不同,很难同时保证激光孔及机械通孔的对准度。本文主要介绍了一种新型的LDI复合对位标靶的设计,通过制程中对位方式的优化重组,以此提升激光孔与机械通孔的涨缩匹配性。
For HDI board there are laser holes and mechanical through-hole at the same time, and the two kinds of holes of the reference point / equipment accuracy are different in the line alignment process. Therefore, in the line alignment process, it is difficult to ensure the laser hole and the mechanical through-hole alignment. It easily leads to laser holes or mechanical through-hole ring deviation. In this paper, a novel design of LDI compound alignment target is introduced to optimize the alignment of the laser hole and the mechanical through hole in the manufacturing process.
出处
《印制电路信息》
2017年第4期56-60,共5页
Printed Circuit Information
关键词
复合对位标靶
激光孔
机械通孔
位移差异性
对位
涨缩
Composite Alignment Target
Laser Hole
Mechanical Through Hole
Displacement Difference
Alignment
Shrinkage