化学抛光在金相实验中的应用

Application of Chemical Polishing in Metallographic Test

一个完整的金相实验程序可分为三个环节，即样品制备、组织显示和结果评定。样品制备又可细分为粗磨（砂轮磨制）、细磨（砂纸磨制）及抛光。其中，样品的抛光所占用的时间最多。通常，金相试样的抛光可分为机械抛光、电解抛光和化学抛光。其中，化学抛光方法具有操作简单、免去多道砂纸磨制和长时间的机械抛光程序，还可多样品同时作业，特别适合工业化大生产中的大量样品的常规检验以及一些特殊要求的金相观察，对快速实现金相实验有着积极的作用。

It is well-known that a complete metallographic procedure includes three steps as sample preparing, microstructure observing and result analyzing. During sample prepara- tion process, a further operation is needed like primary grounding, fine grounding and sur- face polishing. Among the three polishing methods of mechanical polishing, electrolytic pol- ishing as well as chemical polishing, the later has advantages with less time consumption, less complicated operation and preparing a lot of samples at the same time. Therefore, study of chemical polishing on the application of metallographic sample preparation, especially for expansion alloy, is important and helpful to provide a practical method to inspect the quality of metallic functional materials.