Cu对AlN/TiN-Cu复合多层膜微观结构和力学性能的影响

Effects of Cu on Microstructure and Mechanical Properties of AlN/TiN-Cu Nanocomposite Multilayers

采用多弧离子镀膜设备制备了掺杂Cu的AlN/TiN-Cu纳米复合多层膜,利用FESEM、HRTEM和XRD分别表征了薄膜的微观结构和相组成,用压入法和划痕法确定了薄膜的硬度和膜/基结合力,研究了Cu对AlN/TiN-Cu复合多层膜微观结构和力学性能的影响。结果表明,Cu的掺杂对薄膜的微观结构有较大的影响。薄膜的平均晶粒尺寸随Cu含量的增加而逐渐减小。掺入少量Cu后,薄膜的硬度均有提高,但不同种类的薄膜有不同的临界载荷变化趋势,纳米复合单层薄膜的临界载荷有所增大,而纳米复合多层膜的临界载荷反而有所减小。

The nanocomposite multilayers, composed by typical nitride ceramic （AIN and TIN）, have been developed for variety of application for its excellent properties such as structure stability and high hardness as well as low friction coefficient. By adding an appropriate amount of soft metal, the mechanical performance of the film can be significantly improved including intensity, tenacity and friction coefficient, but microstructure and hardness will be greatly influenced. In this work, AIN/TiN-Cu nanocomposite multilayers combining AIN with composite layer formed by adding soft phase metal Cu into hard TiN phase were prepared by multi-arc ion plating equipment. The microstructure and phase composition of the films were characterized by FESEM, HRTEM and XRD respectively. The hardness and the bond strength of the films were detected by Vickers hardness test and scratch method. The effects of Cu on microstructure and mechanical properties of AIN/TiN-Cu nanocomposite multilayers were investigated. The results show that the microstructure of the films was affected by the doping of Cu. The average grain size of the films reduced with the increase of Cu content. The hardness of films increased after the dropping of Cu. However, the critical loads of the films with different types have different changing trends. The critical load of the nanocomposite monolayers increased while that of the nanocomposite multilayers decreased.