陶瓷穿孔三维互连(TCV)技术研究

Through Ceramic Via(TCV) Interconnection Technology

电子装备小型化、高集成度和高可靠性的需求,促使微波电路急需将不同功能的微波多芯片模块叠层而形成垂直互连的三维微波多芯片组件。介绍了陶瓷穿孔互连技术(简称TCV)的概念和结构,对关键工艺技术进行解析,并通过设计试制出TCV集成开关微模块工艺样件。TCV作为高密度微型化互连封装技术将为微系统设计和IP核设计提供新的实现手段。

In order to support the development that electronic devices toward smaller size, higher integration density and higher reliability, the vertical-interconnected 3D microwave multichip module must be implemented by microwave multichip modules stacking along the Z-direction. The concept and construction of TCV （through ceramic via） interconnection technology was introduced, as well as the fabrication processes of TCV is introduced. Also, an integrated switch was demonstrated following the TCV interconnection fabrication processes. The results indicate that the development of TCV interconnection could provide an alternative approach for the realization of higher integration density and miniaturized packaging system in the design of microsystems and IP core.