多芯连接器气密焊接可靠性分析

Discussion on Soldering Reliability of Hermetic Conductors

互连密度高、安装体积小的焊接式多芯连接器在小型化、高集成化的电子装备产品中得到了广泛应用。在生产实践及试验的基础上,针对多芯连接器气密焊接失效率高等问题,从多芯连接器结构特点、材料特性以及焊接工艺等方面分析探讨了影响其焊接可靠性的因素,总结了提高焊接式多芯连接器气密焊接可靠性的结构设计、材料选择和工艺匹配等方法。

Solderable conductors have been widely used in the electronic devices with high density, for the excellent characters such as higher I/O density, smaller volume and hermetic package. Focusing on the problem of air tightness caused by soldering of conductors, the effective way to improve the quality of soldering conductors was discussed in terms of structure of conductors, the choice of materials and soldering process.