摘要
印制电路板埋嵌技术是实现电子装备向轻量化、小型化、高性能及高可靠性方向发展的关键技术之一。采用焊盘连接方式的埋嵌工艺技术,将有源器件埋入电路板内部和嵌入电路板腔体,制作了埋嵌式电路板样件,并对其进行一系列性能测试实验。实验结果证明,该工艺技术具有可行性。根据某军用电子装备的需求,运用该埋嵌式技术,提高了电路板集成度,缩小了电路板尺寸。
The embedded technology of printed circuit board is one of the key techniques for the electronic equipment to achieve lightweight, miniaturization, high performance and high reliability. An embedded PCB sample was manufactured by the means of pad-connection embedded technology, and the active devices were embedded inside and cavities of the PCB. Then, a serial of performance test experiments were implemented for the sample. And the results can verify the feasibility of this technology. According to the requirements of military electronic equipment, the embedded technology was employed to enhance the integration and decrease the size of the printed circuit board.
作者
杨伟
毛久兵
张一
邴继兵
冯晓娟
YANG Wei MAO Jiubing ZHANG Yi BIN Jibin FENG Xiaojuan(No.30 Research Institute of CETC, Chengdu 610041, China)
出处
《电子工艺技术》
2017年第2期80-83,共4页
Electronics Process Technology
基金
十二五基金项目(项目编号:51318070116)
关键词
埋嵌技术
有源器件
印制电路板
焊盘连接
embedded technology
active device
printed circuit board
pad connection
