硅片研磨液的研究

Research of Silicon Wafer Grinding Fluid

伴随着IC制造技术的迅猛发展,IC技术已经渗透到我们生活的各个角落。为了满足IC封装的要求,芯片的厚度不断降低。因此对硅片表面的质量有个更高的要求。介绍了硅片的研磨过程和研磨液的作用,对国内主流研磨液进行了简单的介绍,分析了它们的优缺点。

Along with the rapid development of IC manufacturing technology, IC technology has penetrated into every comer of our life. In order to meet the requirements of IC packaging, chip thickness decrease. So has a higher request about the quality of the silicon wafer surface. Silicon wafer grinding process and grinding fluid are introduced in this role, the domestic mainstream grinding fluid has carried on the simple introduction, analyzed their advantages and disadvantages.