SrTiO_3/SiC/EPOXY复合材料的导热及介电性能研究

Study on The Thermal Conduction and Dielectric Properties of SrTiO_3/ SiC/epoxy Composites

通过将ST与Si C粉末和环氧树脂混合后热压复合制备出系列高介电常数和低损耗的陶瓷/聚合物复合材料。通过对不同温度下的介电性能进行分析表明,复合材料的介电常数和导热系数增加,介电损耗仍保持较低水平。在Si C引入环氧树脂基体后,在体积分数ST:Si C:环氧树脂=20:30:50时的导热系数从0.234至0.884W/(m·K),介电损耗为0.056,介电常数增加至21.7,同时,复合材料表现出更高的击穿强度。

A series of high dielectric constant and low dielectric loss ceramic/polymer composites were prepared with ST, SiC powder and epoxy after blending and hot press technology. The results indicated that the dielectric strength and thermal conduction of composite increases, and the dielectric loss remain low level. The introduction of SiC into epoxy matrix enhance the thermal conduction from 0.234 to 0.884W/ （m· K） at volume fraction ST：SiC：epoxy=20：30：50, and the dielectric loss is 0.056, dielectric constant increase to 21.7, meanwhile, the composites show high breakdown strength.