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DUV辅助高压退火对a-IGZO薄膜微结构及光学特性的影响 被引量:4

Effects of DUV-assisted High Pressure Annealing on Microstructure and Optical Properties of a-IGZO Thin Films
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摘要 利用原子力显微镜和椭圆偏振光谱仪,研究了不同退火温度下深紫外(DUV)辅助高压处理对溶液旋涂法制备的非晶IGZO薄膜微观结构与光学特性的影响。实验结果表明,通过DUV辅助高压退火处理,当退火温度从210℃升高至300℃,薄膜的光学带隙由2.97eV升至3.32eV,而膜表面粗糙层从22.81nm降至5.02nm。300℃-DUV处理的样品与同等压强下300℃无UV处理和350℃退火处理的相比,薄膜的折射率增加并明显地降低了其表面粗糙度,因此,DUV辅助高压退火处理能够有效减少有机化合物的残留,促进了成膜前驱基团的迁移,并形成更加致密的非晶IGZO薄膜。 Effects of deep-ultraviolet(DUV)assisted high pressure at different annealing temperatures on microstructural and optical properties of the a-IGZO films fabricated by solution process were investigated by atomic force microscope and spectroscopic ellipsometry.The results showed that when the annealing temperature was increased from 210℃to 300℃,the optical band gap of the film was increased from 2.97 eV to 3.32 eV,but the surface roughness was decreased from 22.81 nm to 5.02 nm with the DUV-assisted high pressure.Compared to other post-treatment conditions,such as treatment without UV irradiation at 300℃ under the same pressure or treatment with high annealing temperature at 350℃,the refractive index of the DUV treated film at 300℃ was increased and the surface roughness was decreased obviously.Therefore,DUV-assisted high pressure treatment could effectively minimize organic chemical residues and promote the migration of film-forming pioneer group,as well as form more dense a-IGZO film.
出处 《固体电子学研究与进展》 CAS CSCD 北大核心 2016年第2期165-170,共6页 Research & Progress of SSE
基金 国家自然基金资助项目(60776056)
关键词 非晶IGZO薄膜 溶液法 深紫外 椭圆偏振光谱 a-IGZO film solution process deep-ultraviolet spectroscopic ellipsometry
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  • 1Nomura Kenji,Ohta Hiromichi,Takagi Akihiro,Kamiya Toshio,Hirano Masahiro,Hosono Hideo.Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors. Nature . 2004
  • 2Kenji Nomura,Hiromichi Ohta,Kazushige Ueda,Toshio Kamiya,Masahiro Hirano,Hideo Hoso.Thin-Film Transistor Fabricated in Single-Crystalline Transparent Oxide Semiconductor. Science . 2003

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