摘要
在急冷法热疲劳下,热压氮化硅青瓷的机械性能发生了较大幅宣的衰减,材料的抗折强度衰减大于断裂韧性衰减。由于温度对裂纹生长的促进作用,经过多次急冷热循环,材料高温性能,无论强度还是断裂韧性衰减都大于常温性能衰减。热疲劳使材料内部的显微结构发生了显著变化。
Under repeated rapid quenching, the mechanical properties of hot-pressed silicon nitride reduce greatly. Because of the different mechanisms, the reduction in bending strength is much greater than that in fracture toughness. Because of the promotion effect of temperature on carck growth, the mechanical properties at high temperature degrade more seriously than those at room temperature. Also, the microstructure of materials changes greatly due to thermal fatigue.
出处
《硅酸盐学报》
EI
CAS
CSCD
北大核心
1993年第2期188-192,共5页
Journal of The Chinese Ceramic Society
基金
上海市青年科学基金
关键词
热疲劳
热压氮化硅陶瓷
裂纹生长
显微结构
急冷法
thermal fatigue
rapid quenching
hot-pressed silicon nitride ceramics
crack growth
microstructure
