基于模流分析的花洒本体残余应力的改善

Optimization of Residual Stress of Sprinkler Body Based on Mold Flow Analysis

为解决因壁厚差异导致的残余应力过大而致使花洒本体在后续电镀工序中产生的开裂问题,结合模流分析法,提出花洒本体结构的优化方案,在可接受范围内减薄肉厚,保证制品肉厚分布均匀,减小残余应力。实验表明,优化后的产品残余应力明显下降,残余应力较高区域的数值已从原产品的17.796 MPa降至9.013 MPa,残余应力平均值从0.87 MPa降至0.66 MPa。实际生产印证了此优化方案的可行性和有效性。

To avoid the sprinkler cracking in the plating process caused by the large residual stress due to uneven wall thickness, an optimization scheme of the sprinkler was put forward, applying the flow analysis to reduce the wall thickness within an acceptable range so that wall thickness was evenly distributed and the residual stress reduced. Experiments show that the residual stress of the optimized product decreases from 17. 796 MPa to 9. 013 MPa in areas of high residual stress and its mean stress from 0. 87 MPa to 0. 66 MPa. Production has confirmed the feasibility and effectiveness of this optimization scheme.