高纯钨磨削加工试验研究

Experimental Research on High-Purity Tungsten Grinding

为探究适用于高纯钨磨削加工的砂轮,使用80~#绿碳化硅砂轮和金刚石砂轮开展磨削对比试验,从工件表面粗糙度角度评价上述两种砂料对高纯钨磨削加工表面的影响。试验结果表明,绿碳化硅砂轮对应的工件得到了更理想的表面粗糙度。使用绿碳化硅砂轮开展工艺试验,分析在不同磨削参数下加工表面粗糙度的变化趋势,以此为依据对高纯钨磨削加工工艺参数进行评价与优化。综合考虑加工表面粗糙度以及加工效率,得出适合于钨磨削加工的参数为砂轮线速度v_s=23m/s、磨削深度a_p=8μm、工作台进给速度v_w=10m/min,该参数下得到的表面粗糙度均值为0.336μm。

Comparative grinding tests are conducted with 80# green silicon carbide grinding wheel and diamond grinding wheel to research the suitable wheels for the grinding of high-purity tungsten. The influence of the two grinding wheels on the surface roughness is compared. Test results showed that surface roughness of the sample with green silicon carbide grinding wheel is better. To analyze the variation tendency of surface roughness with different grinding parameters and optimize the process parameters for the grinding of high-purity tungsten, processing tests are conducted with green silicon carbide grinding wheel, Considering the surface roughness and machining efficiency, the applicable grinding param- eters for tungsten are： linear speed of grinding wheel vs=23m/s, depth ap=8μm, feed speed vw=10m/min, and the average surface roughness with the parameters is 0.336μm.