金属封装用低阻复合丝研制

Preparation of Compound Wire with Low Electrical Resistivity for Metal Packaging

研究了金属封装用30CrMnSiA/Cu复合丝的制造工艺,并对复合丝界面的显微组织及成分进行了分析。结果表明:复合界面形成了固溶体并牢固地结合在一起。复合丝的电学性能及泄漏率试验结果表明,复合丝具有高的导电性能及良好的气密性能,可以满足低阻引线的封装要求。

In this paper, a manufacturing process for preparing 30CrMnSiA/Cu compound wire which is used for metal packaging is introduced. Microstructure, Electrical properties and Leakage rate of the 30CrMnSiA/Cu compound wire are achieved. The results show that a solid solution is formed between composite interfaces and has strong binding strength.