CMOS芯片结构与制程技术分析

Analysis of CMOS Chip Structure and Process Technology

提出通常接口与芯片剖面(或平面/剖面)结构,并依该结构得到的制程组成电路设计与芯片制造的新接口,介绍了剖面(或平面/剖面)结构技术。设计电路电气特性不仅与电路和版图结构、而且与模型参数、芯片结构参数以及制程等因素都有关。芯片制造一般都要对制程作修改、补充,还需要调整和磨合过程,才能得到合格的芯片。

The paper presents a general interface and chip profile （or plane / profile） structure, which is a new interface between the circuit design and chip fabrication. This paper introduces the technology of profile （plane or section）. The electrical characteristics of the circuit are not only related to the circuit and layout, but also to the model parameters, the chip structure parameters and the process. Chip manufacturing, generally have to modify the process, add and adjust the running in process, in order to get qualified chip.