一种三维芯片间的低功耗单相位调制收发电路

A Low Power Transceiver Using Single Phase Modulation Technique for 3D Integration

基于三维堆叠芯片间电感耦合无线互联的方法,设计了一种用于三维芯片间的低功耗单相位调制收发电路。相比于传统的双相位调制收发电路,单相位调制收发电路能将功耗降低58%,而且不牺牲收发电路的其他性能。采用新芯XMC 65nm CMOS工艺进行设计,电源电压为1.2V,收发电路的工作速度可达1Gb/s,功耗仅为1.25mW,误码率小于1×10^(-13)。单相位调制传输方式能够很好地运用于三维芯片间电感耦合互联的低功耗应用领域。

A low power transceiver using single phase modulation technique in inductive coupling inter-chip wireless link for 3D integration was presented. The total power dissipation of the proposed single phase modulation transceiver was reduced by 58% compared with that of the conventional hi-phase modulation transceiver without sacrificing other communication performances. The transceiver circuit was fabricated in XMC 65 nm CMOS process. Power supply voltage was 1.2 V and data rate was up to 1 Gb/s. From a circuit simulation, a power dissipation of 1.25 mW was achieved and a bit error rate was less than 1×10^-13. Therefore, the singie phase modulation technique was very effective for low power operation in an inductive coupling inter-chip link for 3D integration.