期刊文献+

一种具有浮空P型埋层的新型FS-IGBT 被引量:2

A Novel FS-IGBT with a Floating P-type Layer
下载PDF
导出
摘要 提出了一种在阳极引入浮空P型埋层的新型场截止绝缘栅晶体管(FS-IGBT)。结合超结与阳极短路的思想,在相同仿真条件下,与传统FS-IGBT相比,新结构的击穿电压提高了13.9%。当通态电流密度为150A/cm^2时,新结构的优化压降增量小于9%,关断时间比传统结构降低了60%以上,并且工作时无负阻现象,实现了导通压降与关断功耗的良好折中。 A novel FS-IGBT with a floating P-type layer (FPL) was introduced at the anode portion. It incorporated the super junction and the shorted anode theory. At the same simulation condition, the proposed FS- IGBT' s breakdown voltage was 13.9%0 higher than that of the conventional one. Its optimized forward drop increment was less than 9%, and the turn off time was decreased by more than 60% under a current density of 150 A/cm^2. Additionally, there was no snapback observed. As a result, the proposed FS-IGBT presented a better trade-off between the on-state voltage drop and the turnoff power loss.
作者 陈旭东 成建兵 郭厚东 滕国兵 周骏 袁晴雯 CHEN Xudong CHENG Jianbing GUO Houdong TENG Guobing ZHOU Jun YUAN Qingwen(College of Electronic Science and Engineering, Nanjing Univ. of Posts and Telecommun. , Nanjing 210003, P. R. China National Application-Specific Integr. Circ. (ASIC) Syst. Engineer. Research Center, Southeast Univ. , Nanjing 210096, P. R. China)
出处 《微电子学》 CSCD 北大核心 2017年第2期254-257,284,共5页 Microelectronics
基金 国家自然科学基金资助项目(61274080) 中国博士后科学基金资助项目(2013M541585)
关键词 场截止绝缘栅晶体管 击穿电压 负阻现象 折中关系 FS-IGBT Breakdown voltage Snapback Trade-off relationship
  • 相关文献

参考文献1

二级参考文献26

  • 1Lorenz L, Deboy G, Knapp A, et al.COOLMOS-a New Milestone in High Voltage Power MOS[A].Proceedings of llth ISPSD[C].1999:3-10.
  • 2Leo Lorenz.CoolMOS-A New Approach Toward and Idealized Power Switch[C].Proc. EPE '99 Conf., 1999.
  • 3CHEN Xingbi.Theory of the Switching Response of CB MOST[J].Chinese Journal of Electronics,Jan. 2001,10( 1 ) : 1-6.
  • 4陈星弼.ZL01141993.一种制造含有复合缓冲层半导体器件的方法[P].2004.
  • 5Xingbi Chen.Method of Manufacturing Semiconductor Device having Composite Buffer Layer. US 7192872 B2,2007.
  • 6陈星弼.ZL93115356,具有异型掺杂岛的半导体耐压层[P],1997.
  • 7Xingbi Chen.Voltage Sustaining Layer with Opposite-Doped Islands for semiconductor Power Devices,US 6635906 B1,2003.
  • 8Xingbi Chen,Semiconductor High- voltage Devices,US 6936867 B2,2005.
  • 9Xingbi Chen Semiconductor High-voltage Devices,US 7227197 B2, 2007.
  • 10Xingbi Chen.Semiconductor High-voltage Devices, Appl. No. 11/365,223,2006.

共引文献21

同被引文献2

引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部