摘要
为了评估采用UV-LIGA技术制作的多层MEMS惯性开关的温度可靠性,进行了可靠性强化试验。介绍了开关的结构特征、工作原理和制作工艺。建立了试验系统,对开关进行温度循环和振动冲击试验。利用扫描电子显微镜观察开关失效模式,并利用公式进行热应力分析。试验结果表明,开关主要失效模式为位错和分层。开关热应力分析结果表明,种子层为开关薄弱位置。结合可靠性强化实验和热应力分析结果,从结构设计和制作工艺角度提出了可靠性强化方法。该研究为应用于极限温度环境下的多层UV-LIGA惯性器件的设计与制作提供了试验依据。
To assess the temperature reliability of muhilayer MEMS inertia switch fabricated in UV-LIGA, the reliability enhancement test was carried out and the test results were analyzed. The switch＇s structure characteristics, working principle and processing technology were introduced. A temperature cycle test and a shock test were carried out by the testing system. The failure mode of the switch was observed with scanning electron microscope （SEM）, and the thermal stress analysis was carried out with the theoretical formula. The test results showed that the main failure modes were dislocation and delamination. The theoretical analysis results of thermal stress showed that the seed layer was the weak position of the switch structure. According to the results of reliability enhancement test and thermal stress analysis, some reliability enhancement methods were proposed on the base of structure design and manufacturing process. The research results had provided bases for designing and fabricating the muhilayer UV-LIGA inertial devices at the environments of extreme temperature.
作者
步超
聂伟荣
席占稳
周织建
BU Chao NIE Weirong XI Zhanwen ZHOU Zhijian(School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, P. R. China)
出处
《微电子学》
CSCD
北大核心
2017年第2期279-284,共6页
Microelectronics
基金
国家自然科学基金资助项目(51475245)
