烧结工艺对LTCC基板质量影响分析

Influence Analysis of Co-firing Technology on LTCC Substrates

烧结是LTCC生产的特殊过程。烧结不仅影响着基板的外观、尺寸,还会对基板的电性能产生重要影响。烧结工序对基板质量的影响不仅要从烧结本身的参数来分析,而且也要对LTCC生产过程中的其他工序进行综合分析。这样不仅能找出基板质量问题产生的原因,同时也能防微杜渐,在生产过程中将质量隐患遏制在萌芽阶段。

CO-fLring, serving as a special process in LTCC manufacturing, determines the appearance and sizeof LTCC substrates and influences electrical property. The influence of co-firing entails detailed analysis oncurve parameter and other processes during LTCC manufacturing. Then it will be easy to locate qualityproblems before delivery.