摘要
MEMS麦克风是将音频信号转换成电信号的微型传感器,其工作过程涉及到声学、机械学和微电子学等学科。随着MEMS麦克风封装尺寸的不断缩小和声学性能的不断提升,以电学测试结果作为失效分析出发点的传统半导体失效分析方法越来越难以满足MEMS麦克风失效分析的需要。针对MEMS麦克风独特的封装结构和工作原理,其失效分析方法主要包括声学性能测试、机械性能测试和电学性能测试,并结合传统的半导体物理失效分析手段来找到真正的失效原因及失效机理。
MEMS microphone is a micro-device that converts audio signals into electrical signals, of whichthe operation involves acoustics, mechanics and micro-electronics.Along with ever shrinking package size andenhancing performance, traditional electrical-test-based failure analysis cannot meet new requirements. A newfailure analysis method is presented in the paper, in which the MEMS microphone package structure andworking principle are referenced. The new failure analysis process includes audio signal test, mechanicalproperties and electrical performance test. In addition, traditional semiconductor physical failure analysismethod is also used to dig out the root cause and the failure mechanism.
出处
《电子与封装》
2017年第4期24-29,共6页
Electronics & Packaging
