摘要
采用TI公司的CC2530作为无线传感网络节点的信息检测与处理核心芯片,实现Zig Bee无线传感网络节点的封装。在介绍CC2530芯片的基础上,分析了包括DHT11数字温湿度传感器在内的传感节点的封装过程。采用Altium Designer,完成了传感节点的封装和实现。实验结果表明,封装后传感节点测量的温湿度与天气实况一致,比传统温度计、湿度计更灵敏。
We realize the ZigBee wireless sensor network node encapsulation, by applying CC2530 of TI company as a wireless sensor network node information detection and processing core chip. Based on CC2530 chips,we analyzed DHT11 digital temperature and humidity sensor,sensor node encapsulation process. Using Ahium Designer, complete the accomplished. The experimental results show the sensor measuring is consistent with actual ter, hygrometer. encapsulation and implementation of sensor node can be that the temperature and humidity after encapsulation of weather, and is more sensitive than traditional thermome-
出处
《贵州师范大学学报(自然科学版)》
CAS
2017年第2期93-97,共5页
Journal of Guizhou Normal University:Natural Sciences
基金
贵州省科学技术基金项目(黔科合J字LKS[2013]25号)