墨水直写、喷墨打印和激光直写技术及其在微电子器件中的应用

Direct Ink Writing,Inkjet Printing and Direct Laser Writing Techniques and Their Applications in Microelectronics

直写技术是一种新型微加工技术,其加工过程不需模板并可在亚微米至厘米范围实现材料加工成型。墨水直写、喷墨打印和激光直写作为最常用的直写技术,具有强大的二维、三维成型能力和优异的成型精度,可实现金属、陶瓷、聚合物、水凝胶等复杂构型的程序化构筑,被广泛应用于微电子、组织工程、微流控等领域。阐述了这3种直写技术的构型原理和材料选择,重点介绍了其在微电子器件制造中的应用,讨论了当前研究的难点和热点问题,并对其未来发展趋势进行了展望。

Direct writing is one kind of micro-fabrication technologies which can realize materials fabrication and processing in a broad range of size from sub-micrometer to several centimeters without masks. Direct ink writing, inkjet printing and direct laser writing are the most widely used direct writing technologies which enable fast and accurate fabrication of structures with high resolu- tions. A variety of materials including metals, ceramics, polymers and hydrogels can be processed for the formation of complicated two and three-dimensional architectures by these techniques. Therefore, they are widely used in many different fields such as microe- lectronics, tissue engineering, microfluidics and so on. In this review, we summarize the materials and principles of the three direct writing techniques, discuss their advantages and disadvantages, and then focus on their applications on microelectronics. An overview of the state-of-art developments in this area is given, the main Key words direct writing, microelectronies, electrodes challenges are discussed and the future trends is predicted.