PCB信号传输导体高密度化要求和发展——PCB制造技术发展趋势和特点(1)

PCB manufacturing technology trends and characteristics——High density requirements and development of PCB signal transmission conductors(1)

文章评论了PCB高密度化的要求与发展。IC集成度提高和组装技术进步要求PCB高密度化发展。PCB高密度化:首先是线宽/间隔精细化、导通孔微小化;然后是导线(体)变革、即短线、少线、无线的孔/盘连接技术;最后是走向具有最短、最少(线、孔、盘)连接的埋置(集成)元器件的PCB技术。

This paper reviews the requirements and development of PCB high density. PCB requires high density development with 1C integration improvement and assembly technology progress. PCB high density is the line / space refinement, and via miniaturization etc. Finally PCB technology has the shortest and least （line, hole, pad） connected embedded （integrated） components.