单晶硅超精密切削的刀具磨损试验研究

Experimental Study on Tool Wear in Ultra Precision Cutting of Single Crystal Silicon

针对单晶硅超精密切削过程中金刚石刀具磨损问题,对单晶硅进行超精密车削试验。通过观察金刚石刀具磨损演变过程,分析刀具的磨损过程对表面加工质量的影响,得到刀具磨损机理。结果表明,在超精密切削单晶硅过程中,随着切削距离的增加,刀具磨损面积逐渐增加,加工过程中产生的碳化硅及类似金刚石碳颗粒与刀具后刀面发生划擦造成磨粒磨损;同时,由于交变载荷作用导致的应力疲劳现象,进而伴有解理断裂产生。当切削路程小于4km时,加工表面的粗糙度Ra值在200nm以内,切削路程大于8km时,表面粗糙度Ra值在350nm^400nm之间。

In view of diamond tool wear problem the about single crystal silicon ultra precision cutting process,The ultra-precision turning test on single crystal silicon. Observe the evolution of the diamond tool wear and tool wear process on the quality of the surface finish,tool wear mechanism. Results show that in the process of ultra-precision cutting single crystal silicon,along with the increase of the cutting distance of tool wear is increased gradually,machining process of silicon carbide and diamond like carbon particles brush with cutter blade surface before and after the row of abrasive wear; At the same time,the phenomenon of stress fatigue due to cyclic loading,and accompanied by cleavage wear. When cutting distance is less than 4 km,processing surface roughness Ra value within the 200 nm,cutting distance is greater than 8 km,the surface roughness Ra value between 350 nm ~ 400 nm.