基于Moldflow的手机后盖注塑成型模拟分析与优化

Simulation Analysis and Optimization of Injection Molding of Mobile Phone Back Cover Based on Moldflow

使用Pro/E软件完成某手机后盖三维造型,利用Moldflow软件对制品的有限元模型进行"流动+冷却+翘曲"注塑模拟分析,根据质量(成型窗口)分析的最佳参数组合,优化注塑成型工艺参数并重新进行注塑模拟分析,从注塑制品的充填时间、熔接痕、制品平均温度和翘曲变形量等方面进行综合对比,最终确定了合理的注塑成型工艺参数,改善了制品注塑过程中可能出现的质量缺陷,有效缩短了注塑制品的开发周期。

CAD three - dimensional model of mobile phone back cover is obtained by Pro/E software. By using Moldflow software, “flow ＋ cooling ＋ warp”injection molding is simulated for the finite element model of the product. According to the best parameter combination of the quality （molding window） analysis, the injection molding process parameters were optimized and a new injection molding simulation was completed, then the different aspects of the injection products were synthetically compared, such as fill time, weld mark, average temperature, warp deformation. At last, reasonable injection molding process parameters were determined, and quality defects that may occur were improved in the process of injection molding, and the development cycle of injection molding prod-ucts was effectively reduced.