摘要
半导体封装测试行业已经进入了一个快速发展的时期,面对市场规模的增长和产业竞争的加剧,对半导体封装测试系统的性能进行评估分析,对系统进行合理规划,具有重要的意义。
The semiconductor packaging and testing industry has entered a period of rapid development, in the face of the increase of market scale and the intensification of industrial competition, it is of great significance to evaluate the performance of semiconductor packaging and testing system and make reasonable planning of the system.
出处
《电子测试》
2017年第4期85-86,共2页
Electronic Test
关键词
半导体封装
多环特性
封装测试
semiconductor package
multi-ring characteristics
packaging test
