无氰碱性低锡铜-锡合金电镀工艺

Cyanide-Free Alkaline Low Tin-Content Cu-Sn Alloy Plating Technology

研究出一种无氰碱性低锡铜-锡合金电镀工艺。该工艺具有镀液成分简单、工艺稳定、节能降耗等优点。通过实验确定了最佳的镀液配方和工艺条件为:CuSO_4·5H_2O 45~55g/L,K_2CO_340~60g/L,Na_2SnO_3·3H_2O 8~12g/L,铜螯合剂190~230mL/L,锡螯合剂30~40mL/L,辅助调节剂6~10mL/L,pH值10~11,电流密度1.4~2.0A/dm^2,温度45~55℃。

A cyanide-free alkaline low tin-content Cu-Sn alloy plating technology was presented. This technology has the advantages of simple plating solution composition, stable process, saving energy, etc. The optimum plating solution formula and process conditions determined through experiment were as follows. CuSO4 · 5H20 45-55 g/L, K2CO340-60 g/L, Na2SnO3·3H2O 8412 g/L, copper additive 190-230 mL/L, tin additive 30-40 mL/L, assisted additive 6-10 mL/L, pH value 10-11, current density 1.4-2.0 A/dm2 , temperature 45-55℃.