摘要
Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-ray images for detection However, it has always been difficult to analyze this problem automatically because of some challenges such as noise, inconsistent lighting and void-like artifacts. This study realized accurate extraction and automatic a-nalysis of void defects in solder joints by adopting a technical proposal, in which Otsu algorithm was used to segment solder balls and void defects were extracted through opening and closing operations and top-hat transformation in mathematical mor-phology. Experimental results show that the technical proposal mentioned here has good robustness and can be applied in the detection of voids in BGA solder joints.
基金
National Science and Technology Major Project of the Ministry of Science And Technology of China(No.2013YQ240803)
Shanxi Programs for Science and Technology Development(Nos.20140321010-02,201603D121040-1)
Scientific and Technological Innovation Programs of Higher Education Institutions of Shanxi Province(No.2013063)
