摘要
随着红外探测技术的快速发展,具有长线列/大面阵特征的拼接探测器应用需求越来越广泛。本文结合国内外拼接探测器封装技术的研究情况,分析了拼接探测器冷头结构的常用材料和设计方法,对于拼接探测器的研制具有一定的参考价值。
With rapid development of infrared detection technology, mosaic infrared detector with long linear or large array is widely used. Firstly, the domestic and foreign research situation of mosaic detector packaging technology was introduced briefly, and the common materials and design methods of cold head structure in mosaic detector were ana- lyzed. This study provides a reference for the development of mosaic detector.
出处
《激光与红外》
CAS
CSCD
北大核心
2017年第5期591-594,共4页
Laser & Infrared
关键词
拼接探测器
封装
冷头结构
mosaic infrared detector
package
cold head
