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基于压电雾化喷涂的光刻胶涂覆工艺及其应用研究

Study on photoresist coating process and applications based on piezoelectric spray coating
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摘要 本文在自主搭建的压电雾化喷涂系统上,以RFJ-210负性光刻胶为研究对象,抛光硅片为基材,分别研究了稀释体积比、速度以及距离等喷涂工艺对光刻胶薄膜平均厚度及均匀性的影响。并以表面具有非平面凸台结构的ITO玻璃为基材,分别进行压电雾化喷涂法和旋转法涂胶,实验结果表明:压电雾化喷涂法可以在三维形貌结构表面上涂覆,克服了传统旋转法无法在三维形貌结构表面上涂胶的缺陷,验证了压电雾化喷涂法在三维形貌结构表面应用中的可行性。 The effects of dilution volume ratio, velocity and distance on average thickness and uniformity of the film of RFJ-210 negative photoresist obtained on polished silicon wafer as substrate were analyzed by using a home-buih piezoelectric spraying system. The ITO glass with convex structure was coated with RFJ-210 by centrifugal spinning and piezoelectric spraying methods respectively. The results showed that clear and complete patterns can be formed on three- dimensional structures by piezoelectric spray coating, overcoming the problem that three-dimensional structures cannot be coated by centrifugal spinning method and proving feasibility of piezoelectric spraying for three-dimensional structures.
出处 《黑龙江科学》 2017年第6期98-100,共3页 Heilongjiang Science
基金 江苏省科技项目科技型企业技术创新资金项目(BC2015130) 苏州市科技计划项目姑苏创新创业领军人才专项(ZXL2016035) 吴江区科技领军人才计划项目
关键词 负性光刻胶 压电雾化喷涂 平均厚度 均匀性 抛光硅片 凸台结构 Negative photoresist Piezoelectric spraying Average thickness Uniformity Silicon wafer Convex strueture
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  • 1Watanabe S,Esashi M,Yamashita Y.Fabrication methods for high aspect ratio microstructures[J].Journal of Intelligent Systems and Structures,1997,8:173-176.
  • 2Tan M X,Bankert M A,Griffiths S K,et al.PMMA development studies using various synchrotron sources and exposure conditions[A].Proceedings of the SPIE Symposium on Materials and Device Characterization in Micromachining, Materials and Device Characterizati
  • 3Tabata O, Terasoma K, Aagwa N, et al. Moving mask LIGA (M2LIGA) process for control of side wall iclination [A].The 12th IEEE International Conference on Micro Electro Mechanical Systems[C].Florida:IEEE,1999.252-256.
  • 4Griffiths S K,Ting A,Hruby J M.The influence of mask substrate thickness on exposure and development times for the LIGA process[J].Microsystem Technologies,2000,6:99-102.
  • 5Nilson R H,Griffiths S K.Acoustic agitation for enhanced development of LIGA PMMA resists[A].Proceedings of the SPIE Symposium on Micromachining and Microfabrication,Micromachining and Microfabrication Process Technology VI[C].Santa Clara,CA:SPIE,2000,417
  • 6Griffiths S K,Nilson R H,Bradshaw R W,et al.Transport limitations in electrodeposition for LIGA microdevice fabrication[A].Proceedings of the SPIE Symposium on Micromachining and Microfabrication,Micromachining and Microfabrication Process Technology IV [
  • 7Kim S H,Lee S H,Kim Y K.A high-aspect-ratio comb actuator using UV-LIGA surface micromachining and (110) silicon bulk micromachining[J].Journal of Micromechanics and Microengineering,2002,12(2):128-135.
  • 8Qu W M,Wenzel C,Gerlach G.Fabrication of a 3D differential-capacitive acceleration sensor by UV-LIGA [J].Sensors and Actuators A,1999,77(1):14-20.
  • 9Chang H K,Kim Y K.UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole[J].Sensors and Actuators A,2000,84(3):342-350.
  • 10Bayt R L,Breuer K S,Ayon A A.DRIE-fabricated nozzles for generating supersonic flows in micropropulsion systems[A].Technical Digest Solid-State Sensor and Actuator Workshop[C].Hilton Head Island,SC:Transducer Research Foundation,1998.312-315.

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