微米Ag颗粒对Sn-0.7Cu-xAg钎料焊点组织和力学性能的影响

Effects of Micron Ag Particles on Microstructure and Mechanical Properties of Sn-0.7Cu-xAg Solder Joint

研究了微米Ag颗粒对Sn-0.7Cu钎料焊点组织和性能的影响规律。研究结果表明:在Sn-0.7Cu中加入适量的Ag可以改善钎料的润湿性,但是当加入的Ag含量过高,反而会降低钎料的润湿性。当Ag含量为1%时,润湿性最好,铺展系数K为72.09%。增加Ag含量利于促进β-Sn/Cu6Sn5网状共晶组织的生成和非均匀形核反应的进行,细化β-Sn晶粒。当Ag含量为1%时,钎料焊点的抗拉强度最好,达到47.85 MPa。当Ag含量超过2%时,随着IMC层厚度的增加,焊点的抗拉强度逐渐降低。综合考虑,当Ag含量为1%时,钎料焊点的综合性能最好。

The effects of micron Ag particles on the microstructure and mechanical properties of Sn-0.7Cu solder joint were studied. The results show that adding proper amount of Ag to Sn-0.7Cu can improve the wettability of the solder; while the Ag content is too high, it can decrease the wettability of the solder. When the Ag content is 1%, the wettability reaches the best, and the spreading coefficient K reaches 72.09%. The increase of Ag content is beneficial to the formation of t3-Sn /Cu6Sn5 network eutectic structure and heterogeneous nucleation reaction, and it refines [3-Sn grains. When the Ag content is 1%, the tensile strength of solder joint is the best, which is 47.85 MPa. When Ag content is more than 2%, the tensile strength of solder joint gradually reduces with the increase oflMC layer thickness. Considering all factors, when the Ag content is 1%, the comprehensive performance of solder joint is the best.