环氧树脂/改性氮化硼导热复合材料的制备与性能研究

Preparation and Properties Study of Epoxy/Modified Boron Nitride Thermal Conductive Composites

采用十六烷基三甲基溴化铵(CTAB)改性氮化硼(BN),以此微粒为导热填料制备了环氧树脂(EP)/改性BN导热绝缘复合材料。研究了改性BN含量对复合材料导热性能、电绝缘性能及热稳定性能的影响。结果表明:改性BN能够均匀分散于环氧树脂复合材料中;随着改性BN的加入,复合材料的热导率逐渐上升,体积电阻率略有下降,当改性BN的含量为14.6%时,复合材料的热导率达到0.62 W/(m·K),较纯环氧树脂的热导率提高了169.6%,且复合材料仍保持优异的绝缘性能;随着BN含量的增加,复合材料的热分解温度呈现先升高后降低的变化趋势,当BN的含量为10.2%时,复合材料失重10%时的热分解温度(T10)上升到最高值376.4℃,较纯环氧树脂提高了18℃。

Boron nitride （BN） was modified by hexadecyl trimethyl ammonium bromide, and an epoxy resin thermal conductive and insulating composite was prepared using the modifed-BN as thermal conductive filler. The effects of the modifed-BN content on the thermal conductivity, insulating properties, and thermal stability of the composite were studied. The results indicate that the modified-BN can homogeneously disperse in the epoxy resin composite system. With the addition of the modified-BN, the thermal conductivity of the composites increases gradually, while the volume resistivity decreases slightly. When the modified-BN content is 14.6%, the thermal conductivity reaches 0.62 W/（m.K）, which is 169.6% higher than that of the neat epoxy. Meanwhile, the composite has excellent insulating properties. With the increase of BN content, the thermal decomposition temperature of the composites increases firstly and then decreases. When the BN content is 10.2%, the thermal decomposition temperature of 10% loss weight（T10） for the composite increases to the maximum （376.4℃）, which is 18℃ higher than that of neat epoxy.