聚合物/氮化硼填充型导热界面材料研究进展

Research Progress on Thermal Interface Materials Filled by BN

电子电气等行业的发展更趋向于密集化和微型化。电子器件在工作时会释放出大量热量,能及时将其传导移除,导热界面材料(TIM)在生、散热器件间起到重要作用。氮化硼作为导热填料,优异导热性能、低膨胀率、低电阻系数和化学稳定性,在制备高性能TIM方面越来越受到重视。本文重点介绍了氮化硼的结构以及影响氮化硼/聚合物复合材料导热性能的关键因素,并展望了今后以氮化硼作为填充材料的导热界面材料研究重点和方向。

The development of electronic and electrical industries tended to be intensive and miniaturization. Heatreleased by radiator can be transmitted through thermal interface materials （MIT）. BN has many outstanding propertiessuch as large thermal conductivity, low dielectric constant and high temperature stability, and attracts more and moreattention. The structure of BN, the categories of thermal interface materials substrate as well as influence factors to thermalconductivity property of BN/polymer composites were introduced and some advice to future study were offered.