摘要
分析了0.3×10~4A/cm^2恒定电流密度和四种不同加载时间(0,48,144和240 h)电迁移条件对6.5μm厚镀锡层表面锡须生长行为的影响,以及不同电流密度对阴极裂纹宽度的影响.结果表明,电迁移加速了镀层表面锡须的形成与生长,随着电迁移时间的延长,锡须长度不断增加.此外,电迁移导致在阴极首先出现了圆形空洞,随后在两极均形成了圆形空洞,并且在阴极处还发现有微裂纹存在,随着电流密度增加,阴极裂纹宽度也随之增加,电流密度为0.5×10~4A/cm^2时,平均最大裂纹宽度约为9.2μm.
In this paper,the effect of electromigration on growth behaviors of tin whisker on the tin coating with a thickness of 6.5μm was investigated,the current density was 0.3×10~4A/cm^2,and electromigration loading time was 0 h,48 h,144 h and 240 h respectively.The results show that electromigration accelerate the tin whisker formation and growth on the electroplated tin coating,and the length of the tin whiskers increases with the increasing of electromigration time.In addition,voids occur firstly at the cathode after current loading.With longer loading time,voids are observed at both anode and cathode,and cracks are also found at the cathode.The length of tin whiskers increases with the increasing of current density.The average maximum crack width is close to 9.2μm with the current density of 0.5×10~4A/cm^2.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2017年第4期35-38,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(51674056)
重庆市前沿与应用基础研究资助项目(cstc2014jcyj A40009)
先进焊接与连接国家重点实验室开放课题研究基金资助项目(AWJ-M15-05)
重庆市高校创新团队建设计划资助项目(CXTDX201601032)
关键词
电迁移
锡须
镀层
空洞
裂纹
electromigration
tin whisker
tin coating
void
crack
