摘要
介绍了一款新型实验设备,研发目的是为了测试激光视频投影芯片、激光成像雷达芯片在封装前的各项性能指标。主要介绍了设备结构、主要指标及性能参数。
This paper talks about a new experimental equipment and mainly introduces equipment structures, key technical indexes and performance parameters. The aim is at testing Laser video projector chip＇s and Laser imag- ing radar chip＇s performance index before encapsulation.
出处
《装备制造技术》
2017年第4期215-216,231,共3页
Equipment Manufacturing Technology
关键词
芯片
洁净
结构
chip
decontamination
structure
