摘要
以1,2-二溴苯与2-甲基-3-丁炔-2-醇为原料通过Sonogashira反应合成了1,2-二乙炔基苯,并进一步通过格氏反应合成了邻位含硅芳炔树脂(o-PSA),用~1H-NMR、FT-IR、DSC、TGA等分析手段对o-PSA树脂的结构与性能进行了表征。结果表明,o-PSA树脂室温下是粘稠的液体,能溶解于常用有机溶剂,可在160℃左右固化,且固化放热量低。树脂具有优异的加工性,适用于RTM成型,树脂固化物具有优良的耐热性和介电性能。
The 1,2-diethynylbenzene was synthesized by the Sonogashira reaction of 1,2-dibromobenzene with 2-methyl-3-butyn- 2-ol and then the product was used to produce poly(dimethylsilyene o-diethynylbenzene) (o-PSA) resin through Grignard reaction. The structures and properties of o-PSA resin were characterized by 1H NMR, FT-IR, DSC, TGA and so on. The results showed that the o-PSA resin was a viscous liquid at room temperature and was soluble in common solvents. The resin could be cured at 160 ℃ and had low heat release. The resin had good process ability and was suitable for RTM. The cured product had high heat resistance and good dielectric properties.
出处
《热固性树脂》
CSCD
北大核心
2017年第3期42-47,共6页
Thermosetting Resin
关键词
邻位含硅芳炔树脂
合成
RTM成型
耐热
介电性能
poly(dimethylsilyeneo-diethynylbenzene)(o-PSA) resin
synthesis
RTMmolding
heat-resistance
dielectric property