陶瓷封装电路键合引线冲击应力下的短接判定方法

Method of Short-Circuit Determination of Bonded Wire under Shocked Stress in Ceramic Package Circuit

高可靠集成电路普遍采用陶瓷封装。但是陶封电路内部的空封结构易导致键合线在受到外界机械冲击后引起相邻键合线短接。因此在设计阶段对键合线的选择、布线布局设计、键合工艺参数优化以及封装后的引线抵抗外界应力的能力显得尤为重要。在高速摄像机摄像和电学判定组合方法的基础上,提出一种改进型的键合线短路判定方法。该方法实时对所有被测CQFP228封装的FPGA电路端口进行判定。试验证明,该方法可以大大提高判定评估准确率,降低判定步骤。

High-reliability integrated circuits commonly use ceramic package. However, the internal air-sealed structure of ceramic package circuit is liable to cause the bonding wire short-circuit with adjacent bonding wire when suffering external mechanical shock. Therefore, during the designing, selection of the bonding line, wiring layout design, optimization of bonding process parameters and the package resistance to external stress are particularly important. In the paper, based on the combination of high-speed camera and electrical detection method, an improved type of short circuit detection method is proposed. The method is based on real-time detection of all measured CQFP228 FPGA circuit ports. The test results show that the method greatly improves the accuracy of detection and evaluation, and reduces the detection steps.