摘要
随着封装向轻、薄、小的高密度方向发展,封装引出端从传统的通孔安装THT(Through Hole Technology)向表面安装SMT(Surface Mounting Technology)过渡,引线节距越来越小,I/O数越来越多,特别是细节距封装的表贴集成电路(SMD,Surface Mounting Devices)。细节距封装的SMD引线变薄、变窄,因此引线易弯曲变形造成引线焊接部位不共面,安装时个别引线和PCB板接触不良导致漏接、虚接。介绍了一种精度高和效率较优的翼型引线SMD引线共面性检测方法。
With the rapid development of microelectronics technology, THT is now being replaced by SMT.Especially, the fine pitch SMD is highly integrated with more pins and smaller pitch. But the limitation of fine pitch SMD is the lead coplanarity problem caused by lead deforming. To improve the solder reliability, this article introduces a precise and efficient coplanarity test method for gull wing lead SMDs.
出处
《电子与封装》
2017年第5期12-15,共4页
Electronics & Packaging
关键词
细节距
翼形引线
共面性测量
fine pitch
gull wing lead
coplanarity test
