复合材料表面膜的反应机理及固化行为研究

Study on the Reaction Mechanism and Curing Behavior of the Composite Materials Surface Film

通过差示扫描量热仪(DSC)、红外光谱(FT-IR)、热失重分析仪(TGA)及流变仪对一种改性的环氧基复合材料表面膜的固化反应动力学、反应机理和热性能进行了研究。结果表明:表面膜的反应机理为环氧基与胺类的开环反应;确定了反应的固化工艺参数、反应的表观活化能Ea和频率因子A;表面膜在80~120℃呈低黏度平台区,具有较宽的加工工艺窗口;固化后表面膜的热失重温度约为347℃;此外,表面膜具有良好的悬垂性能。

A modified epoxy composite surface films is used in this experiment. The curing reaction kinetics, reaction mechanism and themal property are studied through differential scanning calorimeter （DSC）, infrared spectroscopy （FT-IR）, thermal gravimetric analyzer （TGA） and rheometer. The results show that the reaction mechanism of the surface film is the ring opening reaction of epoxy and amine. And the curing process parameters, apparent activation energy （Ea） and frequency factor （A） are confirmed. The surface films have a low viscosity platform area at 80-120℃ and a wide processing window. The thermal decomposition temperature of the surface film after curing is about 347℃. In addition, the surface film has good hanging performance.